Ayumi is never satisfied in refining and searching for new technologies to provide its customers complete satisfaction and to meet their ever increasing process needs in time

AYUMI INDUSTRY

Company Profile

Company Name

アユミ工業株式会社
Ayumi INDUSTRY CO., LTD.

Establishment

November, 1969

Capital

22,000,000 yen

Representative

President Hideyuki Abe

Office Location

Head Office ・ Factory
〒671-0225
60, Kagumachi, Besshocho, Himeji City, Hyogo
TEL:+81-79-253-2771     FAX:+81-79-253-6179

Izumo Factory
〒693-0043
659-40, Nagahamacho, Izumo City, Shimane
TEL:+81-853-28-2771     FAX:+81-853-28-2775

Tokyo Office
〒103-0027
3-13-11, Nihonbashi, Chuo-ku, Tokyo
TEL:+81-3-3548-2610     FAX:+81-3-3231-3460

Banks

The Chugoku Bank, Ltd.
Sumitomo Mitsui Banking Corporation
THE SAN-IN GODO BANK, LTD
MUFG Bank, Ltd.

Business Contents

Various machinery and equipment related to vacuum industry
Manufacture and sale of semiconductor manufacturing equipment and its accessories
Engineering on the above
Manufacture and sales of general electronic devices

Business Overview

Our company is a “Research and Development type company” that manufactures and develops electronic and semiconductor components manufacturing related equipment based on vacuum technology. We are devoting our energies to the development and commercialization of “wafer Bonding”, “fluxless reflow equipment,” and “vacuum sealing equipment,” which contribute to higher performance, miniaturization, and weight saving of electronic products and we maintain the top market share of our business field. Above all, “surface activated bonding equipment” has an indispensable technology for bonding at room temperature and dissimilar materials, and contributes to the spread of electronic products for next-generation.  In Ayumi Industry, one third of employees are engineers, and we continue to be “assemblage of engineers” which promotes develops in “It’s an always new methods that cannot be imitated by other companies”, and we propose equipment that matches your needs.

Business Items

【Vacuum Equipment】
Surface activated bonding equipment, Wafer bonding equipment, Fluxless reflow equipment, Vacuum sealing equipment,

Anodic bonding equipment, Wafer Bonding Alignment equipment, LC injection equipment, OEL vacuum deposition Equipment, Vacuum annealing equipment, MBE equipment, CVD equipment, Vacuum glove box with gas purification equipment, Vacuum equipment for research and experiments

【Vacuum components 】

Ultra high vacuum components, Ultra high vacuum flange, Ultra high vacuum chamber, Vacuum accurate positioning unit, Ultra accuracy automatic goniometer, Vacuum valve, Electrical Feedthroughs

【Industrial equipment】

Automation labor saving equipment for semiconductor, Various labor saving equipment, Wafer Bonding Alignment equipment, Image processing equipment, Automatic control equipment, Drying equipment, Annealing equipment

079-253-2771

Please feel free to contact us if you have any questions about products or what can be done with vacuum technology etc.

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