Features of annealing equipment
It can be used to perform anneal processing various objects like silicon wafers and glass substrates, panels, components and materials, etc.
We propose various vacuum annealing equipment like batch type and in-line type.
We have some annealing systems that correspond from a low temperature around 100C゚ to a high temperature over 900C゚.
It also corresponds with gas displacement type (Ar, N₂, Ar + N₂). Vacuuming and heating can be performed automatically.
We also have continuous processing equipment that performs annealing after pretreatment in the glove box.
Introduction of VB-1000
It consists of a round vacuum chamber and a cryopump exhaust system. After the door is opened, the processing material is loaded into the vacuum chamber, and heated, degassed with high vacuum.
Introduction of VB-300
It is an annealing equipment of gas displacement type. There are 3 processing patterns using Ar, N₂ and Ar+N₂, and it can perform annealing up to 10 kg of work weight.
Introduction of VB-200GB
It is an annealing equipment with a glove box. Wafers and cassettes loaded from the pass box can be loaded into the bake chamber through the vacuum glove box, and bake the wafers. After vacuuming glove box, and supplying displacement gas, it can process wafer under condition isolated from atmosphere.
Introduction of IB-55L
It is an In-line type vacuum annealing system for mass production. It consists of a preheating chamber, heating chamber and cooling chamber, and each of the chambers has a high vacuum exhaust system. Jig loading and unloading to the transport tray can be performed automatically.