We propose a variety of bonding equipment which can perform direct bonding of substrates and bonding using intermediate materials like adhesives in the temperature range from high temperature to room temperature.
Variety of bonding
- Room temperature bonding
- Surface activation bonding
- Reduction bonding
- Eutectic bonding
- Anodic bonding
- Resin bonding
- Glass Bonding
Application
- Wafer level package
- Power device
- Gyro sensor
- IR sensor
- Pressure sensor
- Acceleration sensor
- 3D implementation
- Optical MEMS
- LED
- Micro motor
- RF switch
- μ-TAS inkjet head
- Optical switch
- Laser oscillator
- Display
- Prober head
It is an equipment that bonds substrates in a heated air. It…
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It bonds glass such as Pyrex on Si. It is one of the most us…
It is an equipment that bonds wafers each other using an adh…
It is an equipment that bonds by applying temperature and we…
