These systems can perform airtight vacuum sealing for any electronic devices.
The inside of the package can be kept in a gas or vacuum atmosphere, and device characteristics can be stabilized. Solder, eutectic, glass, adhesive, etc.
can be used as sealing material. Furthermore, it can melt the glass and perform an airtight seal or melt the glass beads on the lead wire. In particular, thermal distortion at the time of packaging of a device which is downsized and thinned can be eliminated, and the inside of the package can be maintained at high vacuum. In addition, because it has excellent formability of glass, bead fusion of lead wire with good dimensional accuracy is possible.
After packaging is baked processing, airtight seal is done continuously without exposure to the atmosphere.
Application
- Back-light for liquid crystal panels (CCFL)
- Quartz oscillator
- Xenon lamp electrodes
- Surge absorber
- Arrester
- Each semiconductor packaging
- MEMS packaging
- Lead wire glass bead fusion
- IR sensors packaging
