It is a equipment that performs bumping and soldering with fluxless. It responds to voidless.
Example : Application
| Solder bumping |  |
| Solder ball mounting |  |
| Solder bump bonding |  |
| Sheet solder bonding |  |
| Chip mounting |  |
Features of RF Series
| Formic acid reduction | Since the oxide layer can be removed without melting the solder, solder becomes a refined configuration after reflow. Also, because of the reduction processing at low temperature, the bad effect on the device due to temperature can be eliminated. Furthermore, since the formic acid concentration can be adjusted, it is possible to obtain the optimization for the amount of formic acid consumption. |
| Hydrogen reduction | Reduction is done with hydrogen gas. It corresponds to 100% hydrogen. There is no danger of explosion because the exhausted hydrogen gas passes through our own processing mechanism. |
| Voidless | Because it is a vacuum process, it can be performed with voidless. |
| Fine pitch correspondence | Since reduction gas is used, reduction processing can be applied to a fine pitch. Also, because of fluxless, it is no worry about residue. |
| Efficient heating method | By using our own heating and cooling mechanism, it is possible to rapidly rise and cool down the temperature. It also corresponds workpieces with large heat capacity. |
| Correspondence to a large area | It corresponds to 12 inch wafer and A4 size panel. In addition, it can also handle even larger size workpieces by additional options. |
| No washing | Since flux is not used, conventional flux coating equipment and cleaning equipment are not required, and equipment cost can be reduced. Furthermore, flux cleaning liquid waste disposal is unnecessary. |
RF Series Equipment Lineup
Introduction of RF-310
It is a basic model of one chamber. It is a low cost pursuit type, and a sequence of processing such as vacuum evacuation, reduction processing, heating and cooling is possible in one vacuum chamber. It can be used from testing development to low-volume production.
Introduction of RF-400
It is a basic model of two chambers. It is possible to shorten the cycle time, by providing a chamber which combines preliminary vacuum and cooling. It can be used from testing development to low-volume production.
Introduction of RF-500
It is a fluxless reflow equipment of cluster type for mass production. By the combination of each process chamber, it can perform in the best cycle time. It corresponds to cassette to cassette.
Introduction of RF-510
It is a fluxless reflow equipment of inline type for mass production. It is divided into a preheating chamber, a processing chamber, and a cooling chamber, and can shorten the cycle time by performing in sequence. The preheating chamber can be added as an option.
Introduction of RF-530
It is a fluxless reflow equipment of batch type for mass production. It consists of a processing chamber and an automatic transfer system, and corresponds to cassette to cassette. The workpieces corresponds to both wafer and chip.