It is an equipment that bonds wafers each other using an adhesive such as UV resin. Because it is performed in a vacuum, it can bond substrates applied adhesive and resin substrates with voidless.
Feature of wafer bonding equipment for development
- It is an equipment that bonds wafers each other using an adhesive such as UV resin.
- Because it is performed in a vacuum, it can bond substrates applied adhesive and resin substrates with voidless.
Inotoduction of wafer bonding equipment for R & D
It is a bonding equipment that focuses on bonding substrates in vacuum. It has a simplified positioning unit.
- Bonding equipment for test
- An appropriate for R & D
- It’s focused on cost performance for COO with selected functions.
Introduction of wafer bonding equipment with vacuum alignment for R & D
It is an equipment that performs high accuracy alignment bonding materials such as glass substrates, masks – substrates, and wafers in vacuum.
It corresponds to weight loading and temporary fixing at bonding. It can also add a glove box, and pretreat the substrate in an inert air.
- High accuracy alignment is possible in vacuum.
- It is possible to align the substrates each other, or mask – substrate.
- It corresponds to weight loading and temporary fixing at bonding.
- It also corresponds to simplified alignment by aligning the outer shape.
- It can also add a glove box, and bond in an inert vacuum condition.
Wafer Bonding equipment for mass production
Introduction of wafer bonding equipment for mass production
It is mass production equipment with cassette to cassette. Area inspection and angle deviation inspection after orientation flat alignment, alignment, and bonding are installed.