We realized wafer bonding that can obtain bulk fracture strength at room temperature. It corresponds to bonding equipment for R & D and mass production. It is used in a wide fields such as wafer level package and 3D mounting.
Features of surface activation bonding equipment for development
- Surface activation bonding equipment for research are serialized.
- We offer a variety of proposals from bonding equipment with selected functions to perform activation processing and bonding, to high accuracy alignment, and bonding equipment mounted with analysis system.
Introduction of SAB-60RD1
SAB-60RD1 is a surface activation bonding equipment for test. It is a bonding equipment for test with selected functions of surface activation and bonding.
Flexible responses to sample shape variation enables various types of bonding experiments. It is possible to select the activation source.
Introduction of SAB-60RD3
SAB-60RD3 is a surface activation bonding equipment for test.
Various optional functions such as irradiation and bonding can be added.
It can choose XPS and auger electron spectroscopy for analysis, also outline or mark alignment.
Weighting and heating mechanism can also be added.
Features of surface activation bonding for mass production
- It is an equipment for mass production that bonds after surface activation of substrates like silicon, compound semiconductors, etc. under ultra-high vacuum.
- It can bond at room temperature without using sealing material.
Introduction of SAB-60S
SAB-60S is a bonding equipment with a simplified alignment function. Wafer is loaded in vacuum, and bonded after activation processing.
Wafer is placed in the load lock chamber, and it is loaded into a cassette after bonding by automatic transfer.
Introduction of SAB-60R
SAB-60R is a surface activation bonding equipment for mass production that can load wafers in vacuum and bond them after alignment.
The cassette to cassette system is adopted, and after bonding, the wafer is loaded into the unloading cassette.
Outline fit or using mark methods for alignment can be selected.