It is an equipment that bonds substrates in a heated air. It bonds substrates by applying temperature and weight. We propose various equipment from testing equipment to mass production equipment.
Features of heat bonding equipment
- It is a mass production equipment for anodic bonding, eutectic bonding, glass bonding, frit glass bonding, direct bonding, resin bonding, and adhesive bonding.
We achieved full automation and enhanced mass productivity.
We adopted our own heating method, and it can perform rapid heating and rapid cooling.
It has a structure that can directly heat the substrate and can minimize the difference between the heater temperature and the substrate temperature as much as possible.
It is possible to correspond high precision alignment by using the alignment equipment.
By an option, it can apply recipe management by PC and data logging management, and anodic bonding function.
Introduction of TB-60
It is an equipment for R & D that can perform anodic bonding, eutectic bonding, glass bonding, frit glass bonding, direct bonding, resin bonding, and adhesive bonding.
It adopts our own heating mechanism, and corresponds substrate weight loading and high temperature heating.
Introduction of TB-80R
It is an equipment that enhanced the mass productivity of the heat bonding equipment TB-60.
By automatic transfer, it keeps the bonding chamber air stable, and improved mass productivity.
It corresponds to bonding of maximum 8 inch substrates.
Cooling of substrates can be performed under vacuum or gas condition.
Introduction of TB-80RC
It’s “cassette to cassette” model of TB-80R.
It performed auto-running continuously and labor saving.
10 sets of substrates can be set into the cassette.