It is an equipment that bonds by applying temperature and weight, after the oxide layer can be removed by reducing gas. It corresponds to low temperature bonding of metal using metal nanoparticles etc.
Example: Application of reduction bonding equipment
- Metal low temperature bonding using metal nanoparticles etc.
- Solderless bonding between electrodes
- Voidless bonding using solder material
※ Reduction can lower the bonding temperature of metals including Cu and Ag.
RB Series equipment
Introduction of RB-400
It is a basic model for research and development.
It is a low cost pursuit type, and a sequence of processing such as vacuum evacuation, reduction processing, heating and weighting, and cooling is possible in one vacuum chamber.
It’s appropriate for evaluation of low temperature bonding of metals.
Introduction of RB-800
It is a basic model of processing chamber and load lock chamber.
After highly accurate alignment by mark alignment, a sequence of reduction bonding processes can be performed.
It’s appropriate for bonding of patterned substrates and Cu electrodes, etc