It bonds glass such as Pyrex on Si. It is one of the most used bondings in MEMS. Recently, low temperature bonding has also been realized.
Anodic bonding equipment for development
Introduction of AB-60S-M
It is a basic equipment of anodic bonding equipment.
It adopts our own heating mechanism with fast temperature rise and fall function, and pursues cost performance. It is an appropriate equipment for basic experiments of anodic bonding and low-volume propduction.
Introduction of AB-60D
It is a test equipment that adopts our own heating mechanism with fast temperature rise and fall function, and also can manage the temperature effect on the substrate. High vacuum exhaust is mounted as standard.
Features of anodic bonding equipment for mass production
- It is an equipment for mass production use.
- There are line up as batch type and inline type.
- We also offer a variety of proposals from AB-60A, which corresponds high-accuracy alignment in vacuum, to bonding equipment used in combination with alignment equipment.
Introduction of AB-60A
It is an anodic bonding equipment with alignment equipment.
Alignment and bonding can be performed in vacuum condition.
Alignment and high vacuum exhaust inside the substrate are performed without exposure to the atmosphere.
It is appropriate for exhausting inside gas of the substrate.
The equipment for production is mounted with a loader as standard.
As an option, automatic image processing can be attached.
It corresponds to three-layer bonding.
Introduction of AB-60DL
It corresponds to high-mix low-volume production.
It adopts our own heating mechanism with fast temperature rise and fall function, and also can manage the temperature effect on the substrate.
High vacuum exhaust is mounted as standard.
Introduction of MAB-60
It corresponds to batch type equipment for mass production.
It is an anodic bonding equipment for batch type production.
The jig is placed on the tray, and bonds.
It corresponds to three-layer bonding and vacuuming inside the substrate.
Introduction of MAB-60L
It is an MAB-60 loader adaptable equipment.
It is kept function of MAB-60, and enhanced productivity.
Introduction of IAB-60
It corresponds to mass production, and pursues productivity by inline.
It is an anodic bonding equipment of in line type.
By providing dedicated vacuum chamber for each heating, bonding, and cooling process, it reduces processing time.
A loader is provided as a standard, and bonding is performed automatically when the jig is placed on the loader.
It corresponds to three-layer bonding and vacuuming inside the substrate.
Introduction of AB-60A-S
It is an anodic bonding equipment that bonds under atmospheric pressure.
It is mounted with a rapid heating / rapid cooling mechanism, and corresponds to mass production.